Work

Selective Deposition and Ruthenium Superfill Exploration Beyond A10 Node Interconnects

Year: 2025

Type: conference-paper

DOI: 10.23919/vlsitechnologyandcir65189.2025.11074838

Authors: Marleen H. Van Der Veen, G. Pattanaik, T. Hakamata, Y. Otsuki, A. Romo Negreira, J. Mayersky, K. Yu, R. Yonezawa, H. Suzuki, R. Clark, A. Kumar Mandal, A. Farokhnejad, N. Jourdan, P. Marien, G. Murdoch, H. Struyf, A. Sepulveda Marquez, S. Park, J. Swerts, Z. Tőkei

Institutions: IMEC, Tokyo Electron (Japan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4412966079

FWCI:

Cites: 3

Cited by:

Related to: 10