Work

Reliability Study of Die Attachments in SiC Power Modules with Thermal Balancing Control

Year: 2025

Type: conference-paper

DOI: 10.1109/itec63604.2025.11097929

Authors: Linke Zhou, Jiaming An, Yulei Wang, Di Wang, Giorgio Pietrini, Piranavan Suntharalingam, Mikhail Goykhman, Armen Baronian, Ali Emadi

Institutions: McMaster University, Eaton (United States)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4412986936

FWCI:

Cites: 12

Cited by:

Related to: 10