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Simulation Method and Analysis of Spring Failure in Press-Pack IGBT Devices Based on Electro-Thermal Co-Simulation

Year: 2025

Type: conference-paper

DOI: 10.1109/ieecsc64206.2025.11099851

Authors: Yuqi Wang, Ran Yao, Wei Lai, Hui Li, Wenqian Yuan, Yirun Ji, Minxiang Yang, Qing Huai, Xi Yuan

Institutions: Chongqing University, State Grid Corporation of China (China)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4412987047

FWCI: 2.358

Cites: 7

Cited by: 1

Related to: 10