Thermal Design and Analysis of Power Supply Module Based on Icepak
Year: 2025
Type: conference-paper
Authors: Changquan Pei, Yanjun Zhang, Fan Xu, Jie Ding, Ling Fang
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4412987075