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Environment Adaptability Study of Aerospace CSOP Devices

Year: 2025

Type: conference-paper

DOI: 10.1109/eicct65471.2025.11099637

Authors: Zhibo Yang, Wenyan Wang, Bo Wang, Nana Huai, Xuesong Zheng, Li Ji, Zhe Wang

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413018581

FWCI:

Cites: 4

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Related to: 10