Work

Engineering Poly(ionic liquid) Composites for Silicone-Free Thermal Interface Materials: Enhanced Thermal Conductivity and Interfacial Adhesion

Year: 2025

Type: article

Source: ACS Applied Materials & Interfaces

DOI: 10.1021/acsami.5c12774

Authors: Zhaoyu Lin, Xin Luo, Jianhui Zeng, Taoying Rao, Yucheng Jiang, Linlin Ren, Rong Sun, Yimin Yao

Institutions: Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, Shenzhen Institute of Advanced Electronic Materials, South China University of Technology

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Chinese Academy of Sciences, National Key Research and Development Program of China

Awards: G1043386342, G6320358624, G89388175

OpenAlex ID: W4413051351

FWCI: 1.696

Cites: 53

Cited by: 8

Related to: 10