Work

Pathfinding for Molybdenum Hybrid Metallization

Year: 2025

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

Authors: TaeYeon Oh, Ivan Chakarov, Gonzalo Feijoo, Andras Pap, Kitae Kim, Daniel Faken, Mike Simmermacher, Sandy Wen, Benjamin Vincent, Joseph Ervin

Institution: Lam Research (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413087108

FWCI: 5.113

Cites: 8

Cited by: 1

Related to: 10