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Thermal Modeling and Improvement of 2.5D Chiplet-based Heterogeneous System with Thermal Through Silicon Via

Year: 2025

Type: conference-paper

Source: International Symposium of Electronics Design Automation (ISEDA)

DOI: 10.1109/iseda65950.2025.11101238

Authors: Wen Shi, Yijiao Wang, Jiayao Wu, Tao Zou, Ruotong Liu, Hui Zhang, Fei Liu, Weisheng Zhao

Institutions: Beihang University, Peking University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

OpenAlex ID: W4413120689

FWCI:

Cites: 18

Cited by:

Related to: 10