Work

Mutual Information-Driven Thermal Sensor Planning Method Assisting On-chip Temperature Monitoring at Device-Level Granularity

Year: 2025

Type: conference-paper

Source: International Symposium of Electronics Design Automation (ISEDA)

DOI: 10.1109/iseda65950.2025.11101609

Authors: Wangyong Chen, Weizhi Li, Zhenming Li, Linlin Cai

Institution: Sun Yat-sen University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China

OpenAlex ID: W4413120701

FWCI: 4.554

Cites: 31

Cited by: 2

Related to: 10