Work

AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+

Year: 2025

Type: conference-paper

Source: IEEE MTT-S International Microwave Symposium digest

DOI: 10.1109/ims40360.2025.11103802

Authors: Chenhao Chu, Jinglong Xu, Yuqi Liu, Jianping Zeng, Adam Wang, Takuma Torii, Shintaro Shinjo, Koji Yamanaka, Hua Wang

Institutions: ETH Zurich, Mitsubishi Electric (Japan)

Language: English

Topic: Advanced Power Amplifier Design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413122014

FWCI: 37.73

Cites: 17

Cited by: 16

Related to: 10