Electrothermal Simulation and Vertical Interconnect Planning for Integrated Chiplets
Year: 2025
Type: conference-paper
Authors: Siyuan Miao, Lingkang Zhu, Wenkai Yang, Teng Lu, Yanze Zhou, Chen Wu, Zhiping Yu, Ting-Jung Lin, Lei He
Institutions: Eastern Institute of Technology, Ningbo, Tsinghua University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4413122146