3DGS 3D Heterogeneous Integrated RF Multi-Layers Glass-Interposer System-in-Package
Year: 2025
Type: conference-paper
Authors: Jeb Flemming, Kyle McWethy, Rob Hulsman, Mohamed Basha
Institution: 3D Glass Solutions (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4413122448