Work

Hierarchical Decomposition and Interconnection Method for Efficient Thermal Simulation of Chiplet-Based 2.5D System

Year: 2025

Type: conference-paper

Source: International Symposium of Electronics Design Automation (ISEDA)

DOI: 10.1109/iseda65950.2025.11100833

Authors: Shunxiang Lan, Min Tang, Junfa Mao

Institution: Shanghai Jiao Tong University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

OpenAlex ID: W4413122602

FWCI:

Cites: 15

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Related to: 10