Work

Investigating the optical response of a through silicon via (TSV) for measuring the conic geometry

Year: 2025

Type: conference-abstract

DOI: 10.1117/12.3062397

Authors: Lukas Kellermann, Wiebke Schöttler, Alejandro Avellan

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413123402

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