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New Solution for the Extraction of Interfacial Thermal Resistance in Semiconductors

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Technology (ICET)

DOI: 10.1109/icet64964.2025.11102958

Authors: Xin He, Qingyuan Hua, Jinwen Wang, Hua Fang

Institutions: State Grid Corporation of China (China), State Grid Zhejiang Electric Power Company (China)

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413157146

FWCI:

Cites: 9

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Related to: 10