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Complex High-Speed Interconnect Design Based on Collaborative Bayesian Optimization

Year: 2025

Type: conference-paper

DOI: 10.1109/ecis65594.2025.11087039

Authors: Hongpeng Li, Yanling Wang, Kangrong Li

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413158166

FWCI: 2.358

Cites:

Cited by: 1

Related to: 10