Work

A Significant Role of Rotating Magnetic on Sn-Cu Based Lead Free Solder Alloys for Electronic Applications

Year: 2024

Type: article

Source: Obour Institute Journal for Engineering and Technology

DOI: 10.21608/oijet.2024.446958

Authors: Hassan Abd Elmoniem, Haydy Abdalla, Hamada Kora

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413173160

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