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A Novel Method for TIM Thermal Characteristics Measurement in Package Based on Thermal Test Chips

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Technology (ICET)

DOI: 10.1109/icet64964.2025.11102816

Authors: Xinhao Meng, Yuxin Ye, Binbin Jiao, Yanmei Kong, Ruiwen Liu

Institutions: Chinese Academy of Sciences, University of Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413178273

FWCI:

Cites: 10

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Related to: 10