Work

Research on Thermal Management of 3D Embedded Microchannel Modules Applied to T/R Module

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Technology (ICET)

DOI: 10.1109/icet64964.2025.11103178

Authors: Yizhou Lu, Yuxin Ye, Xiaojiang Yao, Binbin Jiao, Guoliang Zhu

Institutions: Nanjing University of Posts and Telecommunications, Chinese Academy of Sciences, Institute of Microelectronics, Beijing Institute of Technology

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413178966

FWCI:

Cites: 13

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Related to: 10