Work

Multi-Physics Coupling-Based Optimization of Igbt Bonding Wire Geometric Parameters and Thermomechanical Effect Analysis

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Technology (ICET)

DOI: 10.1109/icet64964.2025.11103287

Authors: Zhenguo Liu, Qingbin Wang, Jiamin Chen, Ming Liu, Ri Cai, Ming Ma, Fanghui Yin, Shilin Shi

Institutions: Guangdong Power Grid Company (China), Tsinghua Shenzhen International Graduate School

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413179649

FWCI:

Cites: 10

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Related to: 10