Work

Research Process and Prospects of Power Device Interconnection Technology

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Technology (ICET)

DOI: 10.1109/icet64964.2025.11102947

Authors: Yixiong Song, Zhongyuan Wang, Jiao Yi, Songzhang Tang, Jirui Luo

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413180757

FWCI:

Cites: 26

Cited by:

Related to: 10