Work

Impact of Process Variation Parameters on Propagation Delay in MLGNR VLSI Interconnects

Year: 2025

Type: conference-paper

DOI: 10.1109/eaic66483.2025.11101427

Authors: Anurag Yadav, Pankaj Kumar Das

Institution: Sant Longowal Institute of Engineering and Technology

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413205829

FWCI: 5.113

Cites: 21

Cited by: 1

Related to: 10