Effects of Glass Transition Temperature and Molecular Structure of Bio‐Epoxy on Epoxy Molding Compound Applications for Integrated Circuit Packaging
Year: 2025
Type: article
Source: Polymer Engineering and Science
DOI: 10.1002/pen.70082
Institution: Universiti Sains Malaysia
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Universiti Sains Malaysia
Award: G1059981448
OpenAlex ID: W4413239341