Work

Fracture dynamics in Smart Cut™ technology: Wafer deformation measurement

Year: 2025

Type: article

Abstract: High-Speed Cameras help in characterizing the splitting step in the Smart Cut™ technology. Full wafer-scale deformation monitoring upon annealing is then possible. This paper describes the setup, equipment and methodology used to estimate the backside wafer deformation and curvature upon fracture propagation in situ during the fracture step. Finally, with such a setup, the fracture process of a SOI-ready structure is studied dynamically over the whole propagation time scale. These results are consistent with literature work performed using punctual measurements methods and will allow in the future to emphasize the effect of process’ and structure's geometry.

Source: Solid-State Electronics

DOI: 10.1016/j.sse.2025.109218

Authors: L. Colonel, K. Blanco, S. Tardif, P.E. Acosta Alba, F. Mazen, J. Eymery, D. Landru, F. Rieutord

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, Institut de Recherche Interdisciplinaire de Grenoble, Soitec (France)

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

Estimated APC paid: $2,410

OpenAlex ID: W4413274122

FWCI:

Cites: 19

Cited by:

Related to: 10