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Analysis of Crimping-formed and Sealing Process for Automotive Pressure Sensors

Year: 2025

Type: conference-paper

Abstract: To ensure safe and stable operation of electronic components and functional structural components of automotive pressure sensors under complex working conditions, they shall be sealed and encapsulated. In this paper, the automotive pressure sensors are encapsulated with metal shell crimping-formed and sealing method. The process of crimping-formed and sealing is simulated and analyzed. The structure of crimping-formed and sealing is optimized with response surface method. The reliability of its encapsulation is verified through experiment. The results show that the crimping-formed and sealing process can effectively improve the long-term reliability of the sensors by forming a sealing interface through metal plastic deformation, and provide a new solution for the encapsulation of automotive pressure sensors.

Source: Journal of Physics Conference Series

DOI: 10.1088/1742-6596/3061/1/012034

Authors: Ye Wu, Jiahui Liu, Qin Liu, Chunguang Zhang, Jiarui Liu, Lei An

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: diamond

OpenAlex ID: W4413287183

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