Work

Electrolessly Deposited Co (0.20 at%)-Modified Cu with Greater Thermal- and Electrical Stress-Induced Reliability than Co

Year: 2025

Type: article

Source: Journal of The Electrochemical Society

DOI: 10.1149/1945-7111/adfc9f

Authors: Jau-Shiung Fang, Po-Chun Chen, Yi-Lung Cheng, Giin-Shan Chen

Institutions: National Formosa University, Feng Chia University, National Chi Nan University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Science and Technology Council

Award: G299774832

OpenAlex ID: W4413304726

FWCI: 0.16

Cites: 16

Cited by: 1

Related to: 10