Work

Converging Methods of 2.5-D Heterogeneous Integration Based on Multiple Substrates

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3600111

Authors: Feichi Huang, Mary Vaughan, Chengyu Chiu, Romy Kim, Kyung Jun Lee, Isabel Arias Zambrano, Cecilie Wiuff, Saeed Mohammadi, Peter Bermel

Institution: Purdue University West Lafayette

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319028

FWCI:

Cites: 23

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Related to: 10