Work

Simulation of Temperature Distribution in Large-Area Joints in Power Electronics

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11120943

Authors: Peter Nemergut, Alena Pietrikova, Lubomir Livovsky

Institution: Technical University of Košice

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319331

FWCI: 2.352

Cites: 16

Cited by: 1

Related to: 10