Work

Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11120973

Authors: M. Sprenger, M. Fegus, M. Ockel, C. Hecht, C. Goth, J. Franke, F. Risch

Institutions: Schaeffler (Germany), Friedrich-Alexander-Universität Erlangen-Nürnberg

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319425

FWCI:

Cites: 25

Cited by:

Related to: 10