Work

Development of a New Ceramic Package Design for Special Applications

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11120933

Authors: Pavel Kopřiva, Josef Skácel, Alexandr Otáhal

Institution: Brno University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413319452

FWCI:

Cites: 2

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Related to: 10