Work

Underfill Inspection and Testing in Surface Mount Technology: A Review of Diagnostic and Analytic Methods

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11120978

Authors: Zbyněk Plachý, Ivana Beshajová Pelikánová, Attila Géczy, Karel Dušek

Institution: Czech Technical University in Prague

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319479

FWCI:

Cites: 10

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Related to: 10