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Machine Learning Modelling for Electronic Reliability Analysis in Solder Joints

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11121026

Authors: Cristian Garzon Alfonso, Karsten Meier, Oliver Albrecht, Yichen Qi, Gabriele Patrizi, Lorenzo Ciani, Francesco Grasso, Karlheinz Bock

Institutions: University of Florence, Technische Universität Dresden

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413319535

FWCI: 2.32

Cites: 18

Cited by: 1

Related to: 10