Work

Investigation of Electromigration in Cu-Sn Interfaces under the Condition of High-Current Pulses

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11121002

Authors: Irina Wodak, Golta Khatibti, Andriy Yakymovych, Thomas Walter, Johann Nicolics, Attila Géczy, Oliver Krammer

Institutions: TU Wien, Budapest University of Technology and Economics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Austrian Science Fund

OpenAlex ID: W4413319599

FWCI:

Cites: 14

Cited by:

Related to: 10