Work

Stability of Embedded Solder Joints’ Electrical Resistance

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11121010

Authors: Tomas Lenger, Peter Lukacs, Igor Vehec, Miroslav Jusko

Institution: Technical University of Košice

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319607

FWCI:

Cites: 17

Cited by:

Related to: 10