Advancements in Miniaturization of High-Aspect Ratio Through Ceramic Microvias (TCμV) for High-Density Interconnect LTCC Interposer
Year: 2025
Type: conference-paper
Authors: Nesrine Jaziri, Uwe Ziegler, Jens Müller
Institution: Technische Universität Ilmenau
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Thüringer Aufbaubank
OpenAlex ID: W4413319717