Work

Ultrasonic Bonding of AlCu Wire – An Advance to Reliable Interconnects for Power Modules

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11121053

Authors: Chun-Hao Chen, Anne Groth, Marvin Jügel, Martin Hempel, Tzu-Ting Huang, Thi Minh Anh Dao

Institutions: National Yang Ming Chiao Tung University, Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Deutsche Forschungsgemeinschaft, National Science and Technology Council

OpenAlex ID: W4413319780

FWCI: 2.358

Cites: 2

Cited by: 1

Related to: 10