Work

Influence of Fe and Co Nanoparticle Flux Doping on Stress Relaxation Behaviour of Sn-3.5Ag Solder Joints

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11120918

Authors: Irina Wodak, Sophie Stiefler, Golta Khatibi, Thomas Walter

Institution: TU Wien

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319808

FWCI: 2.358

Cites: 17

Cited by: 1

Related to: 10