Work

Modeling and Analyzing Copper Dendrite Growth during Electrochemical Migration Using Monte Carlo Simulation

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11121049

Authors: Ali Gharaibeh, Ali Dayoub, Balázs Illés, Bálint Medgyes

Institution: Budapest University of Technology and Economics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319839

FWCI: 7.075

Cites: 18

Cited by: 3

Related to: 10