Work

Investigation of the Solder Thickness Effect on the Propagation Properties of Reactive Multilayer Systems

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11120926

Authors: Nesrine Jaziri, Erik Wiss, Uwe Ziegler, Steffen Wiese, Jens Müller

Institutions: Technische Universität Ilmenau, Saarland University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319875

FWCI:

Cites: 11

Cited by:

Related to: 10