Work

Two-Phase Impingement Cooling Using NOVEC-649 with Copper-Inverse-Opal Wick and 3D Printed Microchannel Manifold

Year: 2025

Type: conference-paper

Source: International Conference on Solid-State Sensors, Actuators and Microsystems

DOI: 10.1109/transducers61432.2025.11109783

Authors: Shangyang Shi, Jianyu Du, Zhou Yang, Shaofeng Wang, Jinwen Zhang, Wei Wang, Chi Zhang

Institution: Peking University

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319905

FWCI:

Cites: 10

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Related to: 10