Work

Microstructural evolution of Sn-Cu Based Bi Alloyed Lead-free Solder at Low Cooling Rate

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11120931

Authors: Béla Bodi, Viktor Gonda

Institution: Obuda University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319909

FWCI: 2.358

Cites: 19

Cited by: 1

Related to: 10