Work

Influence of Solder Joint Thermal Resistance on Power MOSFET Heat Dissipation

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11121021

Authors: Adrian Pietruszka, Paweł Górecki, Agata Skwarek-Illés

Institution: Gdynia Maritime University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319981

FWCI:

Cites: 19

Cited by:

Related to: 10