Work

Impact of Prepreg Thickness and Thermal Stress on Thermomechanical Behavior of Printed Circuit Board Substrates

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11120981

Authors: Daniel Koc, Denis Froš, Jakub Zdráhal, Petr Veselý, Karel Dušek

Institution: Czech Technical University in Prague

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413319993

FWCI:

Cites: 12

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Related to: 10