Work

Effect of Fe and Bi Additives on Electrochemical Migration Behavior of SAC105

Year: 2025

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse65583.2025.11121063

Authors: Markéta Klimtová, Iva Králová, Ee Lynn Lee, Yew Hoong Wong, Mohd Faizul Mohd Sabri, Petr Veselý, Karel Dušek

Institutions: Czech Technical University in Prague, University of Malaya

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413320154

FWCI:

Cites: 15

Cited by:

Related to: 10