Work

Extraction of Thermal Packaging Stress via Intrinsic Silicon on Glass Stress Measurement

Year: 2025

Type: conference-paper

Source: International Conference on Solid-State Sensors, Actuators and Microsystems

DOI: 10.1109/transducers61432.2025.11111343

Authors: Ahmet Arif Aslan, Erdinc Tatar

Institution: Bilkent University

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413320483

FWCI: 2.358

Cites: 10

Cited by: 1

Related to: 10