Work

EML Assembled with Flip-Chip Technology on AlN Sub-Mount Operating at 212.5 Gbps PAM4

Year: 2025

Type: conference-paper

Source: OptoElectronics and Communications Conference and International Conference on Photonics in Switching and Computing (OECC/PSC)

DOI: 10.23919/oecc/psc62146.2025.11110318

Authors: Kei Masuyama, Mizuki Shirao, Asami Uchiyama, Takuma Fujita, Yutaka Yoneda, Kenichi Abe, Chikara Watatani, Shunto Katsumi, Nobuo Ohata

Institution: Mitsubishi Electric (Japan)

Language: English

Topic: Semiconductor Lasers and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413320831

FWCI: 4.717

Cites: 4

Cited by: 2

Related to: 10