High-Density Direct Au-Au Interconnects Using Thermo-Compression Bonding for Heterogeneous Integration
Year: 2025
Type: conference-paper
Authors: Nishant Kr. Sharma, Ankit Priya, Prosenjit Sen
Institution: Indian Institute of Science Bangalore
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4413320856