Work

Integration Methods for Co-Packaged Optics using Sin-to-Polymer Waveguide Coupling

Year: 2025

Type: conference-paper

Abstract: We present broadband silicon-nitride to polymer waveguide adiabatic coupling interfaces with sub-1 dB loss around 1310 nm, validated using two integration methods: lithography and flip-chip bonding, achieving sub-2dB chip-to-chip and chip-to-fiber coupling loss. Keywords: Photonic integrated circuits, Photonics-Electronics integration, Packaging technology of photonic devices and circuits, Tapered and grating waveguides for optical coupling, Si photonic and heterogeneous platform, On-board optics and co-packaged optics for high-capacity interconnects

Source: OptoElectronics and Communications Conference and International Conference on Photonics in Switching and Computing (OECC/PSC)

DOI: 10.23919/oecc/psc62146.2025.11110865