Work

A PSPI/PSEP/PSPI Nanocomposite Polymer Interposer Technology for Wireless Edge-AI Microsystem Integration

Year: 2025

Type: conference-paper

Source: International Conference on Solid-State Sensors, Actuators and Microsystems

DOI: 10.1109/transducers61432.2025.11109785

Authors: Yu-Chia Chang, Ting-Yu You, Yun-Chien Tseng, Shih-Chieh Chen, Pin-Cheng Tseng, Yu-Ting Cheng, Chien-Nan Kuo, Der-Hsien Lien, Chung-Tse Michael Wu, Yu-Tao Yang

Institutions: National Yang Ming Chiao Tung University, National Taiwan University, MediaTek (Taiwan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Semiconductor Research Corporation

Award: G1009591161

OpenAlex ID: W4413320971

FWCI:

Cites: 11

Cited by:

Related to: 10