Work

A Method for In-Situ On-Wafer Compression Test of Microbeams

Year: 2025

Type: conference-paper

Source: International Conference on Solid-State Sensors, Actuators and Microsystems

DOI: 10.1109/transducers61432.2025.11109886

Authors: Yi Chen, Dacheng Zhang

Institution: Peking University

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413321716

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Cites: 4

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Related to: 10